Yes. There are two main solutions:
① Lump/Neckdown Detection: The F Series, TL-2000 Series, and TL-3000 Series all support lump/neckdown detection. The TL-3000 Series offers a sampling rate of up to 80 kHz, making it suitable for high-speed production and supporting defect imaging.
② Surface Defect Inspection: The surface defect inspection system can visually detect particles and other surface abnormalities on enamelled wire.
Yes. DALA’s TL Series can measure both round and flat wire with a single device, supporting parameters such as outer diameter, width, thickness, ovality, and lump/neckdown defects.
The surface defect inspection system can detect defects such as burn marks, bulges, neckdowns, wrinkles, and bubbles.
Provides end-to-end support from product selection to production line operation through on-site guidance and after-sales technical support.