How can wire dimensions be measured more accurately?
How can bumps and surface defects be detected earlier?
And what about more challenging applications, such as fine wires and wire-drawing dies?
This time, DALA Measurement is bringing more than
the six solution lines we’ve been developing
— we’re bringing them all to Shanghai.
Specifications on paper are one thing
but how the equipment measures on a real production line
how stable the data is and how smoothly it operates
are best judged in person
If you’re currently exploring
diameter measurement, bump detection, surface-defect inspection, and length measurement
fine-wire or wire-drawing die measurement
come by and talk with us
